Heat Sink, DIP, Adhesive, 8.5 °C/W, DIP, 19 mm, 4.8 mm, 51 mm

Heat Sink, Square, Circuit Board, For SMT Packages, 27 °C/W, DIP, PLCC, SMD, 15.3 mm, 8 mm, 15.3 mm

Fan/forced heat sink, hollow aggregate, 0.175 °C/W, 74 mm, 62 mm, 150 mm, 56 m3/h, 41 dBA

Heat sink, 0.42 °C/W, 100 mm, 40 mm, 300 mm

Heat Sink, Square, PCB, Black Anodized, 3.8 °C/W, TO-220, 25 mm, 38.1 mm, 41.6 mm

Radiator, Cold Forged, 30 mm, 14 mm, 30 mm

Heat Sink, TO-220, 9 °C/W, SOT-32, TO-3P, TO-220, 34.9 mm, 12.7 mm, 50.8 mm

Heat Sink, Ball Grid Array, Standard, 12.2 °C/W, BGA, 27.8 mm, 11.2 mm, 27.8 mm

Liquid Cold Plate, 6-PASS, 12 Inch

Heat sink, BGA, FPGA, double sided tape, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm

Heat sink, 0.4 °C/W, 240 mm, 46 mm, 150 mm

Heat Sink, TO-3, 1.4 °C/W, TO-3, 88 mm, 35 mm, 100 mm

Heat sink, 2.2 °C/W, 93 mm, 14 mm, 150 mm

Heat Sink, Square, PCB, Extruded, 10.2 °C/W, TO-220, 34.53 mm, 38 mm, 12.53 mm

Heat sink, for transistors, TO-220, black anodized, 30 °C/W, TO-220, 20.5 mm, 11.5 mm, 19 mm

Heat pipe, flat, 50 W, aluminum, 100 mm, 30 mm, 1.6 mm

Heat sink, 17.9 °C/W, 15 mm, 20 mm, 25 mm

Heat Sink, TO-220, 8 °C/W, SOT-32, TO-3P, TO-220, 34.9 mm, 12.7 mm, 63.5 mm

Radiator, 3.6 K/W, 76 mm, 16.8 mm, 37.5 mm

Heat sink, Extruded range - 2, Black anodized, 1.5 °C/W, 100 mm, 40 mm, 100 mm