Heat Sink, BGA, Black Anodized, BGA, 35 mm, 25 mm, 35 mm

Heat sink, 7.6 °C/W, TO-220, 42 mm, 20 mm, 38 mm

Heat sink, 7.1 °C/W, TO-220, 42 mm, 25 mm, 38 mm

Heat Sink, Extrusion, PCB Mount, 6.5 °C/W, SOT-32, TO-3P, TO-220, 42 mm, 38.1 mm, 25 mm

Heat Sink, TO-218/220/247, 20.2 °C/W, TO-218, TO-220, TO-247, TO-248, 20 mm, 27 mm, 9 mm

Heat Sink, for Ball Grid Array, 30 °C/W, BGA, 14 mm, 6 mm, 14 mm

Heat sink, extruded, 2.5 °C/W, 100 mm, 15 mm, 75 mm

Heat sink, aluminum, TO-220, 23.2°C/W

Heat Sink, 3.3 °C/W, TO-3, 65 mm, 20 mm, 50 mm

Heat Sink, Ball Grid Array, Standard, 22 °C/W, BGA, 23 mm, 6 mm, 23 mm

Heat Sink, TO-220, TO-218, 4.9 °C/W, TO-218, TO-220, 46 mm, 33 mm, 50 mm

Heat sink, T-slot, 1.1 °C/W, 96 mm, 40 mm, 150 mm

Heat Sink, Ultra-Fin™, 0.12 °C/W, 101.6 mm, 32 mm, 100 mm

Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

Heat Sink, PCB, Board Level, 21.6 °C/W, TO-126, 22 mm, 19 mm, 19 mm

Heat Sink, Square, PCB, 25.9 °C/W, TO-220, 13.21 mm, 9.52 mm, 19.05 mm

Heat Sink, for Isolated Power Modules, 0.33 °C/W, IGBT Power Modules, 125 mm, 135 mm, 300 mm

Heat sink, DIP, Adhesive, 46 °C/W, DIP, 6.3 mm, 4.8 mm, 19 mm

Fan/forced heat sink, hollow aggregate, 0.085 °C/W, 120 mm, 122 mm, 200 mm, 237 m3/h, 59 dBA

Heat sink, DIP, Adhesive, 50 °C/W, DIP, 19 mm, 4.8 mm, 6.3 mm